Name: Advances in Smart Materials and Structures (en Inglés)
Price: 92.68 USD
Availability: InStock
Author: Wang, Bing ; Lee, Tung Lik ; Qin, Yang
ISBN: 9783036595603

portada Advances in Smart Materials and Structures (en Inglés)

Advances in Smart Materials and Structures (en Inglés)

Formato

Libro Físico

Editorial

Mdpi AG

Autor

Wang, Bing ; Lee, Tung Lik ; Qin, Yang

Idioma

Inglés

N° páginas

206

Encuadernación

Tapa Dura

Dimensiones

24.4 x 17.0 x 1.8 cm

Peso

0.64 kg.

ISBN13

9783036595603

Categorías

Tecnología: cuestiones generales

Advances in Smart Materials and Structures (en Inglés)

Wang, Bing ; Lee, Tung Lik ; Qin, Yang (Autor) · Mdpi AG · Tapa Dura

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Reseña del libro "Advances in Smart Materials and Structures (en Inglés)"

Smart materials and structures are capable of active or passive changes in terms of shapes, properties, and mechanical or electromagnetic responses in reaction to an external stimulus, such as light, temperature, stress, moisture, pH, and electric or magnetic fields. They have attracted increasing interest for their enhanced performance and efficiency over a wide range of industrial applications, especially for aerospace. These require novel engineering approaches and design philosophies in order to integrate the actions of sensors, actuators, and control circuit elements into a single system that can respond adaptively to its surroundings. This reprint has collected cutting-edge research and recent advances in smart materials and structures, including seven original research papers and three review articles, co-authored by 65 scientists and engineers from 18 institutions and 3 industries. The research topics mainly cover advanced materials, applications of smart materials and structures, as well as recent development in sensing techniques. We hope this reprint will contribute to disseminating the latest progress in smart materials and structures, as well as stimulate the interest of its audience to work in this important and vibrant area to promote and benefit the multidisciplinary scientific communities.