Name: High Performance Design Automation for Multi-Chip Modules and Packages (en Inglés)
SKU: 59208234
Price: 122.32 USD
Availability: InStock
Author: Cho, Jun Dong ; Franzon, Paul D.

portada High Performance Design Automation for Multi-Chip Modules and Packages (en Inglés)

High Performance Design Automation for Multi-Chip Modules and Packages (en Inglés)

Formato

Libro Físico

Editorial

World Scientific Publishing Company

Autor

Cho, Jun Dong ; Franzon, Paul D.

Idioma

Inglés

N° páginas

264

Encuadernación

Tapa Dura

ISBN13

9789810223076

Categorías

Ingeniería: general
Ingeniería electrónica
Ciencias de la computación

High Performance Design Automation for Multi-Chip Modules and Packages (en Inglés)

Cho, Jun Dong ; Franzon, Paul D. (Autor) · World Scientific Publishing Company · Tapa Dura

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Reseña del libro "High Performance Design Automation for Multi-Chip Modules and Packages (en Inglés)"

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.