Name: High-Reliability Semiconductor Devices and Integrated Circuits, 3rd Edition (en Inglés)
SKU: 69069390
Price: 68.56 USD
Availability: InStock
Author: Yiqiang Chen;Yi Liu;Changqing Xu
ISBN: 9783725887576

portada High-Reliability Semiconductor Devices and Integrated Circuits, 3rd Edition (en Inglés)

High-Reliability Semiconductor Devices and Integrated Circuits, 3rd Edition (en Inglés)

Formato

Libro Físico

Editorial

MDPI AG

Autor

Yiqiang Chen;Yi Liu;Changqing Xu

Idioma

Inglés

N° páginas

134

Encuadernación

Tapa Dura

ISBN13

9783725887576

High-Reliability Semiconductor Devices and Integrated Circuits, 3rd Edition (en Inglés)

Yiqiang Chen;Yi Liu;Changqing Xu (Autor) · MDPI AG · Tapa Dura

Libro Nuevo Importado

Envío: 17 a 24 días háb.

$ 137.11$ 68.56

-50%

Costos de importación incluídos en el precio ✅

Libro Nuevo

Quedan más de 100 unidades

$ 68.56

Llega entre el 23 Nov y el 04 Dic a Quito, Pichincha. Seleccionar ubicación

Agregar a lista de deseos

Reseña del libro "High-Reliability Semiconductor Devices and Integrated Circuits, 3rd Edition (en Inglés)"

The rapid development of intelligent transportation, aerospace electronics, avionics, and safety-critical systems has increased the demand for reliable semiconductor devices and integrated circuits. These applications require stable operation under harsh conditions, including radiation, electromagnetic interference, temperature variations, and aging. Meanwhile, complex SoC architectures and heterogeneous integration bring new challenges to reliability analysis, functional safety verification, and design optimization. This Reprint, "High-Reliability Semiconductor Devices and Integrated Circuits", provides a platform for research on modeling, simulation, design, optimization, and reliability evaluation of semiconductor devices and circuits, with applications in automotive electronics, aerospace systems, and other critical fields. Recent advances in semiconductor technologies, fault-tolerant architectures, radiation-hardening methods, and safety verification have improved system reliability. Artificial intelligence and data-driven approaches also enable efficient reliability prediction, design automation, and fault analysis. This Reprint highlights research on reliability modeling, simulation methods, optimization techniques, and evaluation approaches under extreme environments. Future high-reliability systems require collaboration among the areas of semiconductor technology, circuit design, electronic design automation, artificial intelligence, and functional safety engineering. Read more