portada Robust Joining and Assembly Technologies for Ceramic Matrix Composites: Technical Challenges and Opportunities (en Inglés)

Robust Joining and Assembly Technologies for Ceramic Matrix Composites: Technical Challenges and Opportunities (en Inglés)

Formato

Libro Físico

Autor

Nasa Technical Reports Server (Ntrs)

Singh Mrityunjay

Editorial

Bibliogov

Idioma

Inglés

N° páginas

Encuadernación

Tapa Blanda

Dimensiones

24.6x18.9x0.1 cm

Peso

0.07 kg.

ISBN13

9781287291671

Categorías

Política y gobierno

Robust Joining and Assembly Technologies for Ceramic Matrix Composites: Technical Challenges and Opportunities (en Inglés)

Nasa Technical Reports Server (Ntrs) (Autor) · Singh Mrityunjay (Autor) · Bibliogov · Tapa Blanda

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Reseña del libro "Robust Joining and Assembly Technologies for Ceramic Matrix Composites: Technical Challenges and Opportunities (en Inglés)"

Fiber reinforced ceramic matrix composites are under active consideration for use in a wide variety of high temperature applications within the aeronautics, energy, process, and nuclear industries. The engineering designs require fabrication and manufacturing of complex shaped parts. In many instances, it is more economical to build up complex shapes by Joining simple geometrical shapes. Thus, joining and attachment have been recognized as enabling technologies for successful utilization of ceramic components in various demanding applications. In this presentation, various challenges and opportunities in design, fabrication, and testing of high temperature joints in ceramic matrix composites will be presented. Various joint design philosophies and design issues in joining of composites will be discussed along with an affordable, robust ceramic joining technology (ARCJoinT). A wide variety of ceramic composites, in different shapes and sizes, have been joined using this technology. Microstructure and mechanical properties of joints will be reported. Current status of various ceramic joining technologies and future prospects for their applications will also be discussed.