portada Shipboard Bonding, Grounding, and Other Techniques for Electromagnetic Compatibility, Electromagnetic Pulse (EMP) Mitigation, and Safety (en Inglés)

Shipboard Bonding, Grounding, and Other Techniques for Electromagnetic Compatibility, Electromagnetic Pulse (EMP) Mitigation, and Safety (en Inglés)

Formato

Libro Físico

Autor

Department Of Defense

Editorial

Lulu.com

Idioma

Inglés

N° páginas

Encuadernación

Tapa Blanda

Dimensiones

27.9x21.6x0.3 cm

Peso

0.14 kg.

ISBN13

9781304271129

Categorías

Educación

Shipboard Bonding, Grounding, and Other Techniques for Electromagnetic Compatibility, Electromagnetic Pulse (EMP) Mitigation, and Safety (en Inglés)

Department Of Defense (Autor) · Lulu.com · Tapa Blanda

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Reseña del libro "Shipboard Bonding, Grounding, and Other Techniques for Electromagnetic Compatibility, Electromagnetic Pulse (EMP) Mitigation, and Safety (en Inglés)"

1. SCOPE 1.1 Scope. This document specifies standard practices to facilitate achievement of the intra-ship and inter-ship electromagnetic compatibility (EMC), electromagnetic pulse (EMP), bonding, and intermodulation interference (IMI) requirements of MIL-STD-464. 1.2 Application. The requirements specified herein apply to metal and nonmetallic hull ships and are applicable during ship construction, overhaul, alteration, and repair. Requirements herein may be invoked upon contractor and government (military and civilian) personnel. 1.3 Tailoring. The requirements herein may be tailored with NAVSEA 05H3, Navy technical warrant authority, approval. 1.4 New materials and technology. To achieve requirements of this standard while reducing lifecycle maintenance costs, implementation of new materials and technology is encouraged. The new materials and technology should not prevent the ship from meeting all applicable MIL-STD-464 E3 performance requirements, and must not introduce EMI or safety problems.