Name: Tsv 3d rf Integration: High Resistivity si Interposer Technology (en Inglés)
SKU: 56719159
Price: 251.07 USD
Availability: InStock
Author: Shenglin Ma; Yufeng Jin
ISBN: 9780323996020

portada Tsv 3d rf Integration: High Resistivity si Interposer Technology (en Inglés)

Tsv 3d rf Integration: High Resistivity si Interposer Technology (en Inglés)

Formato

Libro Físico

Editorial

Elsevier

Autor

Shenglin Ma; Yufeng Jin

Idioma

Inglés

N° páginas

292

Encuadernación

Tapa Blanda

ISBN13

9780323996020

N° edición

Tsv 3d rf Integration: High Resistivity si Interposer Technology (en Inglés)

Shenglin Ma; Yufeng Jin (Autor) · Elsevier · Tapa Blanda

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Reseña del libro "Tsv 3d rf Integration: High Resistivity si Interposer Technology (en Inglés)"

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.