Name: 3d ic stacking technology (en Inglés)
SKU: 3895438
Price: 227.22 USD
Availability: InStock
Author: Wu, Banqiu ; Kumar, Ajay ; Ramaswami, Sesh
ISBN: 9780071741958

portada 3d ic stacking technology (en Inglés)

Formato

Libro Físico

Autor

Ajay Kumar

Banqiu Wu

Sesh Ramaswami

Editorial

McGraw-Hill Companies

Año

2011

Idioma

Inglés

N° páginas

544

Encuadernación

Tapa Dura

Dimensiones

22.9x15x2.3 cm

Peso

0.77 kg.

ISBN

007174195X

ISBN13

9780071741958

Categorías

Electrónica: circuitos y componentes
Dispositivos y materiales electrónicos
Ingeniería de las comunicaciones/las telecomunicaciones

3d ic stacking technology (en Inglés)

Ajay Kumar (Autor) · Banqiu Wu (Autor) · Sesh Ramaswami (Autor) · McGraw-Hill Companies · Tapa Dura

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Reseña del libro "3d ic stacking technology (en Inglés)"

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.3D IC Stacking Technology covers: High density through silicon stacking (TSS) technologyPractical design ecosystem for heterogeneous 3D IC productsDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stackProcess integration for TSV manufacturingHigh-aspect-ratio silicon etch for TSVDielectric deposition for TSVBarrier and seed depositionCopper electrodeposition for TSVChemical mechanical polishing for TSV applicationsTemporary and permanent bondingAssembly and test aspects of TSV technology